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"...The RAM market faces disruptive challenges from SSDs - just as hard disks have done. At some time during the next 5 years - most of the world's new DRAM will be deployed inside an SSD or an SSD controlled loop. Owning an SSD brand will be as important in the new market for memory makers as getting designed into tier 1 server slots was in the past. Commercial RAM makers will have to re-engineer themselves into SSD companies - or risk lower profit margins from selling to SSD brands at spot market prices from outside the SSD box."
...Editor:- talking to a market strategist in one of the world's biggest seminconductor companies in June 2011.

RAM

the Memory Guy - blog by Jim Handy founder of Objective Analysis
RAM based SSDs
RAM Cache Ratios in flash SSDs
DRAM spot market prices - daily
Flash vs DRAM Price Projections
A brief history of database RAM storage
RAM SSDs versus Flash SSDs - which is Best?
The World's First Commercial DRAM - Intel 1103
3rd Party RAM - Your Legal Rights to Server Warranties
Everything You Wanted to Know about SOC Memory (pdf)
What Every Programmer Should Know About Memory (pdf)
Hybrid Memory Cube spec ready for chip designers

Editor:- April 3, 2013 - back in October 2011 - I reported on this page the formation of a new industry ORG - the Hybrid Memory Cube Consortium - which could have an impact on future SSD packaging densities.

It takes a while to get these things going - but according to a press release this week by one of the founding companies - Micron - the 100 plus companies which are collaborating in this enterprise have agreed on an interface specification (pdf).

A key feature of the new multiplane memory architecture is that distributed memory controllers in an HMC module will handle the data I/O packet requests for the bunch of stacked memory chips in its own vault. This is similar to the distributed intelligent data mover concept which is already used in all proprietary big architecture SSD controller designs - because it's the only way you can get good aggregated global system performance while also dealing with low level local memory management issues at low latency.

As with earlier generations of remote distributed memory interfaces - such as InfiniBand - HMC is designed to optimize the request of small packets - which in the case of HMC is 16 to 128 bytes of data.

With today's semiconductor speeds - accessing the data in those distributed memory chips within the same HMC module presents similar technical problems to distributed memory cards in traditional computer designs - because traversing inches of physical space at high speed is as difficult as moving data across tens of feet at slower speeds.

HMC has been born as a DRAM technology - but don't ignore it - just for that reason. (Or because the data packet sizes are small compared to the block sizes in nand flash.) If and when these HMC packaging ideas result in viable products - the ideas and methodologies will spill into SSDs too -regardless of what the underlying memories used in SSDs may be at that time.

It's all about speed and scalability. According to the HMC faqs page - A single (1st generation) HMC unit can provide more than 15x the bandwidth of a DDR3 module. See also:- SSD interface glue chips.


Micron sources power holdup technology for NVDIMMs

Editor:- November 14, 2012 - Micron has signed an agreement with AgigA Tech to collaborate to develop and offer nonvolatile DIMM (NVDIMM) products using AgigA's PowerGEM (sudden power loss controller and holdup modules).


Virtium screens for cooler running DRAM

Editor:- June 13, 2012 - Virtium Technology has launched a new range of low power DDR3L memory modules - in 4GB and 8GB capacities - which have been designed using a combination of techniques including screening for lowest total electrical current and thermal-relief copper pour methodology PCB design.

This reduces DRAM surface temperatures up to 10°C which can also increase performance in hot systems - because the need to perform double refresh rates (at or above 85°C) is obviated.


NEC Hitachi Memory dream ends in Elpida bankruptcy

Editor:- February 27, 2012 - Elpida today announced it is reorganizing under the code of the bankruptcy laws in Japan.

Editor's comments:- The company's press release (pdf) relates a detailed history of problems starting in 2007 with the credit crunch, over capacity, falling RAM prices, increasing strength of Yen etc. The company - Japan's biggest surviving RAM maker - started out as NEC Hitachi Memory in 1999 and changed its name to Elpida in 2000.

Elpida never got into the SSD market. Now it looks like it never will.

A report in the New York Times says - "Elpida's bankruptcy filing is the biggest ever by a Japan-based manufacturer..."


Viking ships nv 8GB DDR3 DIMM

Editor:- October 18, 2011 - Viking Modular Solutions said it is shipping an extension of their nv module range.

The DDR3 ArxCis-NV plugs into standard RAM sockets and provides 2GB to 8GB RAM which is backed up to SLC flash in the event of a power failure - while the memory power is held up by an optional external 25F supercap pack. Viking says these new memory modules can eliminate the need for battery backup units in servers and the maintenance logistics associated with maintaining them. They are specified as being maintenance free for "5 years @ 60°C".

Editor's comments:- will these new modules replace batteries in RAM SSDs? - I doubt it - because of scalability issues - like managing a spiderweb of 100+ dangly bits of wire when you have a terabyte of RAM. Having said that - there are many applications which only use a small number of memory chips which could benefit from such a product.


Hybrid Memory Cube will enable Petabyte SSDs

Editor:- October 7, 2011 - Samsung and Micron this week launched an new industry initiative - the Hybrid Memory Cube Consortium - which will standardize a new module architecture for memory chips - enabling greater density, faster bandwidth and lower power.

"HMC is unlike anything currently on the radar," said Robert Feurle, Micron's VP for DRAM Marketing. "HMC brings a new level of capability to memory that provides exponential performance and efficiency gains that will redefine the future of memory."

Editor's comments:- HMC may enable SSD designers to pack 10x more RAM capacity into the same space with upto 15x the bandwidth, while using 1/3 the power due to its integrated power management plane.

The same technology will enable denser flash SSDs too - if flash is still around in 3 years' time and hasn't been sucked into the obsolete market slime pit by the lurking nv demons which have been shadowing flash for the past 10 years and been waiting for each "next generation" to stumble and be the last.

The power management architecture integrated in HMC and the density scaling it allows for packing memory chips (without heat build-up) are key technology enablers which were listed as some of the problems the SSD industry needed to solve in my 2010 article - this way to the Petabyte SSD.
Robert Dennard - inventor of DRAM.
Find out more about people who have shaped storage history.
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Partial list of past and present RAM manufacturers - mentioned in storage news / history.

A-DATA, Adtec , AGIGA Tech , Alliance Semiconductor, ANACAPA, Apacer Memory America, ATP Electronics, Austin Semiconductor, Avant North America, Cambex , Century Microelectronics, Corsair Memory, Crucial Technology, Cypress Semiconductor, Dane-Elec Memory, Dataram, EDGE Tech, Elpida Memory, Fairchild Semiconductor, Gigaram, Hynix Semiconductor, IBM Microelectronics, Inotera Memories, Kentron Technologies, Kingston Technology, MemoryTen, Micro Memory, Micro Memory Bank, Micron Technology, Mosel Vitelic, Mushkin, MoSys, Nanya Technology, NEC, Netlist, Patriot Memory, Piiceon, PNY Technologies, Qimonda, Ramaxel Technology , Ramtron , Renesas Technology, Rocky Mountain Ram, Samsung Electronics, Silicon Mountain Memory, Silicon Power , SimpleTech, SMART Modular Technologies, Southland Micro Systems, Spansion, STMicroelectronics, Swissbit, TopRam, Toshiba, Transcend Information, TwinMOS Technologies, Unigen, Viking Modular Solutions, VisionTek, White Electronic Designs, Winbond Electronics , Z Tech International.
The world's first terabyte RAM SSDs were launched in February 2003 by 2 competing companies (who were both SSD advertisers here on StorageSearch.com at that time).

Compatible with fibre-channel SANs, the Tera-RamSan (from Texas Memory Systems) and MegaRam-10000 (from Imperial systems) each delivered about 1 million IOPS, consumed 5kW and cost around $2 million.

....from the article - SSD History
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re RAM - by Zsolt Kerekes, editor
RAM - Random Access Memory - is the fastest type of storage.

It's implemented by silicon chips which can contain upto thousands of millions of storage bits (gigabits) connected in a randomly accessible array.

The "random access" part of the RAM name was to differentiate RAM from earlier types of memory (more than 30 years ago) which were stored in blocks (or rings) which meant that reading or writing to selected memory bits involved processing the contents of the block through a shift register. RAM was easier to write software for and faster.

RAM has equal read and write access times (unlike flash memory). Other significant differences to flash are:-
  • the data stored in a RAM is only maintained while the device is powered up (is volatile)
  • RAM doesn't suffer from write wear-out (endurance)
  • RAM is typically more expensive than flash for the same capacity, and typically uses more electrical power. The exception is smaller capacity memories inside a chip where the complexity of managing flash memory incurs more overhead than the much simpler overheads in RAM.
RAM products have different designs and are optimized for various markets (such as servers, notebooks and graphics cache) based on their speed, cost, interface and capacity.

The earliest SSDs used battery backed RAMS. RAM SSDs still exist in 2011 and are economic in some high performance applications and sometimes use flash as the internal backup medium (instead of hard disks) to enable fast boot.

RAM is susceptible to random data corruption by radioactive particles which occur naturally in many locations - and which also strike the earth from cosmic rays. That's why ever since the earliest high density DRAM memory systems were designed in the 1970s - it has been necessary to integrate various types of error correction - ranging from simple parity checks, and error correcting codes right up to active data monitoring and healing in high capacity RAM SSDs which is implemented by dedicated RAM controllers.
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SSD ad - click for more info
RAM
Megabyte found that RAM gave him the
fastest access to what he was seeking.
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the Solid State Disks Buyers Guide
The SSD Buyers Guide lists all SSD products commercially available in the market by form factor, interface type and memory technology. It also includes a summary of key milestones in the SSD market in the past year.
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SSD ad - click for more info
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3rd Party RAM,, article by Keystone Memory
3rd Party RAM, Your Rights on Server Warranties - article by Keystone Memory

Users know that memory and hard disk drives aren't made by most of the companies from whom they buy their servers, notebooks and desktops. But they are often intimidated from competitively buying 3rd party upgrades by sales tactics aimed at locking them in to a single source.

Such tactics often hint that maintenance contracts and warranties will be void or negatively impacted by the presence of 3rd party upgrade products. That kind of anti competitive pressure is illegal in many countries. This article provides an overview of the legal protection that users may have under a US law called Magnuson and Moss. ...read the article
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