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Tezzaron is a full
service turn-key supplier of 3D and 2.5D memory, memory subsystems and
memory-intensive SoCs. Tezzaron specializes in 3D wafer and die stacking, TSV
processes and wide-ranging collaborations, creating commercial parts as well as
custom devices for prototyping and production. For more information, visit
www.Tezzaron.com. |
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Editor's comments:- Among other
things Tezzaron has developed
packaging
technologies which can deliver high density storage modules - such as
DRAM - by stacking chips
and indeed complete wafers which interconnect via the company's design of
special tungsten contacts.
The company also designs customizable
heatsinks which can enable stacked memories to be packed closely while reducing
heatspots.
Tezzaron claims to have the most powerful repair
architecture in the industry which includes finer-grained repair and redundant
circuit elements. | |
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| Tezzaron expects to ship
ReRAM SSDs in 2016 |
Editor:- January 23, 2015 -
Tezzaron Semiconductor
today
announced
it will use Rambus's
ReRAM technology in forthcoming storage-class 3D memory devices for military,
aerospace and commercial applications.
The first of these designs
is scheduled for production in 2016. | | |
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